| Ziptronix provides market-leading solutions enabling IDMs, fabless semiconductor companies and foundries as well as packaging houses to build 3D integrated circuits (ICs). We have developed and patented the only scalable 3D integration technology resulting in reduced system costs, decreased system size, minimized circuit board complexity, elimination of wire bonding, adhesives and spacers in stacked applications to provide the highest performance and lowest cost solutions. We offer a number of semiconductor integration strategies and technologies for 3D IC and SoC production and 3D integration can include MEMS devices with CMOS logic.
Our key technologies include:
Direct Oxide Bonding (ZiBond™)
- Room temperature, hermetically (MIL 883E) sealed oxide bonding of Silicon, III-V and other dissimilar materials
Direct Bond Interconnect (DBI®)
- DBI® for highest density and most scalable interconnect (<1 Micron Pitch possible)
The Ziptronix technology is derived from more than seventeen years of basic material research that resulted in an elegantly simple but highly efficient solution for volume production to achieve room temperature, covalent bonds. Ziptronix process technologies are designed to use standard fab equipment and not require any expensive custom or specialty wafer processing equipment.
Direct Bond Interconnect (DBI®) Fact Sheet |
 
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