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White Papers
The following links will open PDF files of white papers developed by Ziptronix engineers.
White Paper Title
Low Cost of Ownership Scalable Copper Direct Bond Interconnect 3D IC Technology for 3D IC Applications (PDF)
Scalability and Low Cost of Ownership Advantages of Direct Bond Interconnect (DBI
®
) as drivers for volume Commercialization of 3D Integration architectures and applications (PDF)
TCPE Substrate White Paper (PDF)
MEMS - Mainstream Process Integration (PDF)
3D Integration for Mixed Signal Applications (PDF)
Embedded DRAM Market to Grow 21.3% - High-End Communications to Dominate Consumption (PDF)
Benefits of 3D Integration in Digital Imaging Applications (PDF)
For more information, please contact
info@ziptronix.com.
