ZIPTRONIX CEO HIGHLIGHTS CRUCIAL ROLE OF LOW TEMPERATURE BONDING TECHNOLOGY IN ACHIEVING 3D IC INTEGRATION
Ziptronix introduces “Jeremy, the ultimate 3D IC customer” at technical conference…
November 18, 2008
Burlingame, Ca. – The future success of the semiconductor industry will depend on how successful it is in implementing 3D IC technology to meet the demands of a 17-year-old consumer named Jeremy, according to Ziptronix CEO Dan Donabedian. In a presentation at the fifth annual 3-D Architectures for Semiconductor Integration and Packaging conference today in Burlingame, CA, Donabedian described the role his company’s revolutionary bonding technology will play in the emerging 3D IC supply chain.
Ziptronix, Inc., based in Research Triangle Park, NC, is a leader in IP for innovative 3D integration technology for advanced CMOS ICs, with established patent protection for its ZiBond™ low temperature covalent bonding (US Patent 7,387,944) and DBI® direct bond interconnect (US Patent 6,962,835) technologies.
The Ziptronix CEO described “Jeremy” as the ultimate customer for 3D IC technology. “In order to succeed, the semiconductor industry is going to have to figure out how to supply ‘Jeremy’ with the chips that make for better cell phones, lighter ultra-mobile PCs, portable multimedia players with pico-projectors, handheld gaming devices, safer automobile sensors, and more sophisticated medical imaging equipment,” he explained. “And they will have to implement 3D IC technology to realize the higher density, lower costs and increased functionality, connectivity and reliability that these applications will require.”
According to Donabedian’s presentation, one of the crucial elements for successful implementation of 3D IC technology is a reliable, economical, low temperature oxide bonding process that will enable true 3D integration of semiconductors. “A high throughput bonding process that achieves true metal-to-metal interconnect without requiring high temperature or compression has long been seen as the ‘missing link’ in the 3D IC supply chain that is now taking shape in the semiconductor industry,” he explained. “Ziptronix technology will be one of the key factors in making 3D IC integration a mainstream semiconductor technology.”
Donabedian sees “Jeremy” (and the next generation of electronics consumers) as ready to buy a host of integrated applications that will be enabled by 3D IC technology, including:
• Mobile phones with high resolution digital cameras and increased functionality
• Ultramobile, low power, lightweight PCs
• Interactive handheld gaming devices with projection capabilities
• Embedded pico-projectors in a variety of portable multimedia devices
• Advanced automotive sensors (lane change/collision warning)
• Sophisticated medical imaging systems
The Ziptronix processes can be implemented throughout the present semiconductor supply chain – by the OEMs/IDMs; by fabless and ‘fab-lite’ companies; by the major foundries; by semiconductor tool manufacturers and EDA vendors; and by the OSAT houses. “Through licensing of this patented technology, Ziptronix anticipates being able to add value to each phase of this emerging 3D IC supply chain,” Donabedian explained.
For more information about Ziptronix 3D IC technology, contact info@ziptronix.com or call 919-459-2400.
About the conference
The 5th annual 3-D Architectures for Semiconductor Integration and Packaging conference was held November 17 – 19, 2008 at the Hyatt Regency San Francisco Airport Hotel in Burlingame, CA. Organized by the Research Triangle Institute (RTI International) as part of its Technology Venture Forum Series, the conference brings together senior technologists and managers from leading companies, universities and research organizations involved in the 3-D IC supply chain. For more information, visit: http://techventure.rti.org.
About Ziptronix
Ziptronix is a pioneer in the development of low temperature oxide bonding technology for advanced semiconductor applications. Founded in October 2000, Ziptronix was spun out from North Carolina’s RTI International for the purpose of commercializing their revolutionary wafer and die bonding (ZiBond™) and interconnect (DBI®) technologies. The company has an extensive worldwide patent portfolio covering the fundamental concepts behind economical low temperature oxide bonding.
Ziptronix technology provides the lowest cost solution for low temperature wafer-to-wafer and die-to-wafer bonding, delivering significant advantages in size reduction, lower production costs, lower power consumption and increased system performance.
Ziptronix licenses its technology to customers across the entire semiconductor manufacturing supply chain – OEMs/IDMs, foundries, semiconductor equipment manufacturers and OSATs – to enable them to quickly implement reliable, economical 3D IC integration using standard processing equipment.
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