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Press Releases & Articles
Press Releases
Date
Image
Ziptronix Licenses DBI® to Raytheon for Imaging Systems
November 18, 2009
Ziptronix takes $1.8M recap tranche
February 2, 2009
Ziptronix Developing IP Licensing Strategies for 3D IC Bonding Process
January 30, 2009
Ziptronix CEO Highlights Crucial Role of Low Temperature Bonding Technology in Achieving 3D IC Integration
November 18, 2008
Economical Low Temperature Wafer/Die Bonding Process Identified As Missing Link in Emerging 3D IC Supply Chain
November 11, 2008
Ziptronix Direct Bond Interconnect (DBIŽ) Technology Delivers Lowest Cost 3D IC Integration
October 22, 2008
Articles
Date
Publication
Staying on the Path to Moore's Law Requires 3D Integration
August 2009
SOCcentral
Future Wafer Level Packaging (WLP) Solutions for CMOS Image Sensors
April 2009
Chip Scale Review
Ziptronix and DBI(R) Metal
December 2008
Semiconductor International
ZiptronixJoins Low cost Quest for True 3D-IC
October 2008
Semiconductor International
3D Startup is Ahead of Its Time
October 2008
Semiconductor International
Innovative Method for Bonding and Interconnect: A 3D Subsystem Solution
April 2007
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