Press Releases
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Press Releases & Articles
Press Releases
Date
Image
Ziptronix revolutionizes chip interconnect for three-dimensional integrated circuits
October 17, 2005
Ziptronix produces world's first 3D SOC
September 26, 2005
Articles
Date
Publication
Innovative Method for Bonding and Interconnect: A 3D Subsystem Solution
April 2007
Advanced Packaging
Wafer bonding reaches new heights... and lows!
April, 2006
Chip Scale Review
Sematech targets infrastructure for 3-D chips
January 16, 2006
EEtimes
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