Press Releases
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News
Press Releases & Articles
Press Releases
Date
Image
3D News: Semiconductor International
November 23, 2009
Ziptronix Licenses DBI®
November 20, 2009
M&A Electronics News Letter
November 19, 2009
Ziptronix Licenses DBI® to Raytheon for Imaging Systems
November 18, 2009
Ziptronix takes $1.8M recap tranche
February 2, 2009
Ziptronix Developing IP Licensing Strategies for 3D IC Bonding Process
January 30, 2009
Ziptronix CEO Highlights Crucial Role of Low Temperature Bonding Technology in Achieving 3D IC Integration
November 18, 2008
Economical Low Temperature Wafer/Die Bonding Process Identified As Missing Link in Emerging 3D IC Supply Chain
November 11, 2008
Ziptronix Direct Bond Interconnect (DBIŽ) Technology Delivers Lowest Cost 3D IC Integration
October 22, 2008
Articles
Date
Publication
Backside illumination, wafer-scale optics drive 2x-5x jump in CMOS image sensor performance - Baron, Yole Developpment
May 24, 2010
Yole Developpment
3D Integration is poised to drive the next generation of military imaging sensors
February 2010
Military and Aerospace Electronics
Staying on the Path to Moore's Law Requires 3D Integration
August 2009
SOCcentral
Future Wafer Level Packaging (WLP) Solutions for CMOS Image Sensors
April 2009
Chip Scale Review
Innovative Method for Bonding and Interconnect: A 3D Subsystem Solution
April 2007
Advanced Packaging
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