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Ziptronix, a leader in developing next-generation semiconductor integration strategies and
processes, makes tomorrow’s high performance IC applications available today. Based on
the patented room temperature wafer bonding process, Direct Bond Interconnect (DBI™)
technology enables 3D architectures with the smallest footprint and the smallest volumetric
size of any technologies available. DBI™ further improves the performance, increases density,
and improves device yield, while providing the lowest cost solution. Backed by the most
advanced 3D technologies available, Ziptronix is your partner for the future.
Contact us today. info_@ziptronix.com
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