Ziptronix’ business is to license its ZiBond™ and DBI® processes for both development and production partnerships. We license these technologies throughout the semiconductor supply chain to IDMs, fabless companies and foundries. Ziptronix provides support for our licensees in the form of early stage device development, supply chain creation, and technology transfer. As the premier 3D IC facilitator, licensing the Ziptronix technologies is your key to market dominance and sustainability.

For more information about how to license our leading-edge 3D IC wafer bonding technologies, please contact Ziptronix at info@ziptronix.com

Ziptronix' patent portfolio includes US and foreign patents related to direct bond and 3D device, circuit, integration, packaging and encapsulation technologies. There are currently 27 issued and 10 pending US patents as well as over 100 foreign filings throughout the world.

Detailed descriptions of US patents can be found at the US Patent and Trademark Office http://www.uspto.gov by doing a keyword search on Ziptronix.

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