Founded in October 2000, Ziptronix was spun out from North Carolina's RTI International for the purpose of commercializing a revolutionary wafer and die bonding technology. Setting the next generation standard for the manufacturing of integrated circuits, Ziptronix' mission is to deliver innovations to the electronics industry, and continually advance the way semiconductor products are designed and manufactured. 

Ziptronix technology lowers high manufacturing and packaging costs and increases yield associated with CMOS image sensors (IS), high-speed logic and memory-on-processor manufacturing. Ziptronix’ Direct Bond Interconnect (DBI®) technology enables silicon to be bonded in a 3D fashion to maximize the density of signal paths that chips use to interconnect transistors. DBI® maximizes the electrical connections between the separate components and extends bandwidth by alleviating the interconnect delays with scalable 3D routing. Ziptronix technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering significant advantages including: size reduction, reduced 3D IC production costs, lower power consumption and increased system speed and performance.

Previous industry attempts have failed to deliver 3D ICs with multiple complete layers of active devices. Thermal constraints, restrictions in power and ground distribution, mismatches in material expansion, temperature dependent characteristics, exotic adhesives, and other issues have perpetually plagued development. Ziptronix' innovative 3D circuit technology alleviates all these limitations, and is the only viable, low-cost method to achieve true 3D integration.