Ziptronix’s room temperature direct silicon oxide bond process is an ideal choice for wafer-to-wafer bonding. The ZiBond bonding process is performed at room-temperature without adhesives, and utilizes standard manufacturing equipment and chemicals typically found in today's merchant foundries. Once activated, Ziptronix wafers have an activation shelf life of several hours, thereby facilitating high-volume, batch-driven production. Some examples of materials that can be bonded with Ziptronix’s DBI™ and ZiBond technologies either directly or by depositing a thin layer of oxide include.
- Aluminum Nitride
- Beryllium Oxide
- Diamond
- Gallium Arsenide
- Gallium Nitride
- Germanium
- Glass
- Indium Phosphide
- Lithium Niobate
- Lithium Tantalate
- Pyrex
- Quartz - Fused
- Quartz - Single Crystal
- Sapphire
- Silica - Fused
- Silicon
- Silicon Carbide
- Silicon Germanium
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Lithium Tantalate bonded to Quartz
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