Applications
As the marketplace continues to demand smaller, higher performance products the need for smaller effective smaller solutions becomes paramount. The major challenge for today’s products is the reduction of overall system costs and power consumption as complexity and functionality continue to
to increase. 3D technology delivers low profile, high performance and low cost solutions for consumer, mobile, networking and enterprise products. It is the optimal
choice for reducing inductance and capacitance, while providing improved thermal performance in the smallest profile.
Chip Stacking
High Performance, low profile solutions can be realized by using Through-Silicon Via and DBI™ technologies. High reliability Direct Bond and Interconnect technology makes possible high density interconnect between stacked devices. Delivering improved performance and reliability over conventional stacking bump and wire-bond technologies in the smallest profile. Applications include high performance SiP, Stacked Memory and Memory Module and Multichip Modules.
3D Integrated Circuits
Designing chips based upon 3D technology will provide the smallest, fastest and lowest power solutions. Specialty memory using 3D technology is already available today. 3D architectures are beginning to emerge for memory and high performance computing solutions, for parallel computing; network, graphic and image processing and mixed signal.
Silicon Substrate
Silicon substrates with fine pitch metal interconnect and through-silicon vias deliver significant performance, power, size and cost improvements over conventional SiP, bump and wire-bond technologies. Thermal matching between the substrate and the chips make possible high density, high reliability interconnect. In addition the substrates can be embedded with passive and active circuits for power management, filtering and noise suppression and are compatible with off-the shelf as well as custom silicon devices.
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