| Ziptronix covalent bonding technology enables a new generation of wafer-scale, hermetic encapsulation solutions for advanced MEMS devices. Ziptronix ZiBondtechnology enables custom encapsulation structures to bond with device substrates at room temperature, without adhesive, using a completely dry, single or double-side process that is benign to the sensitive die. The process results in a completely hermetic bond that has been certified to the MIL-STD-883E hermetic standard.
Ziptronix’s DBI technology has been successfully tested with the most advanced optical MEMS devices and headspace chemistries. Ziptronix’s proprietary interconnect process, combined with ZiBond, enables the direct 3-D integration of MEMS devices with conventional CMOS logic and memory circuits to provide chip-scale system solutions. This enables consolidation of all testing, assembly and packaging operations within the fab, thereby achieving production economies far exceeding any other approach.
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