Affordable DBI® (Direct Bond Interconnect) is the most economical wafer bonding process. Scalable DBI® is scalable to <1 micron pitch with improved alignment/placement tools. Patented Virtually all low-temperature oxide bonding processes are likely to be covered by one or more Ziptronix patents.
ZiBond™ DBI®
Only Ziptronix offers a proven, reliable. high-volume low temperature oxide bonding process that can be implemented at all levels of the 3D IC supply chain.
